The metal oxide semiconductor field effect
transistor or MOSFET is based on the original field-effect transistor introduced in the
70s. The invention of the power MOSFET was partly driven by the limitations of bipolar power junction transistors (BJTs) which, until recently, was the device of choice in power
electronics applications.
In 1960, Dawon Kahng and Martin M. (John) Atalla at Bell Labs invented MOSFET. Operationally and structurally different from bipolar junction transistor,[BJT] the MOSFET was made by putting an insulating layer on the surface of the semiconductor and then placing a metallic gate electrode on that. It used crystalline silicon for the semiconductor and a thermally oxidized layer of silicon dioxide for the insulator. The silicon MOSFET did not generate localized electron traps at the interface between the silicon and its native oxide layer, and thus was inherently free from the trapping and scattering of carriers that had impeded the performance of earlier field-effect transistors. Following the (expensive) development of clean rooms to reduce contamination to levels never before thought necessary, and of photolithography and the planar process to allow circuits to be made in very few steps, the Si − SiO2 system possessed such technical attractions as low cost of production (on a per circuit basis) and ease of integration. Largely because of these two factors, the MOSFET has become the most widely used type of integrated circuit.
The principal reason for the success of the MOSFET was the development of digital CMOS logic,[20] which uses p- and n-channel MOSFETs as building blocks. Overheating is a major concern in integrated circuits since ever more transistors are packed into ever smaller chips. CMOS logic reduces power consumption because no current flows (ideally), and thus no power is consumed, except when the inputs to logic gates are being switched. CMOS accomplishes this current reduction by complementing every nMOSFET with a pMOSFET and connecting both gates and both drains together. A high voltage on the gates will cause the nMOSFET to conduct and the pMOSFET not to conduct and a low voltage on the gates causes the reverse. During the switching time as the voltage goes from one state to another, both MOSFETs will conduct briefly. This arrangement greatly reduces power consumption and heat generation.
Answered by
Kannan
, an ibibo Specialist,
at
11:36 AM on February 19, 2008